Product Details

Product Details

Machine Introduction:

Loading:
The substrate is manually placed into the substrate fixture, which is then inserted into the automatic loading/unloading magazine. Chip trays or blue tapes are manually placed as well.

Automatic Workflow:

1.After startup, the automatic loading/unloading system transfers the substrate fixture to the substrate worktable and secures it.

2.The substrate worktable moves the substrate under CCD1 for image recognition and positioning. The system performs position compensation.

3.The dispensing manipulator dips epoxy from the glue reservoir and dispenses it onto the substrate (dispensing can also be performed in spray mode).

4.CCD3 locates the chip.

5.The chip pick-up manipulator picks up the chip from the wafer and places it onto the calibration station’s lower nozzle.

6.Using CCD2, the chip is identified and calibrated with position compensation in X, Y, and θ directions.

7.The chip placement manipulator picks up the chip and places it onto the substrate. During placement, a certain amount of bonding pressure is applied to ensure firm adhesion, completing the die attach process.

8.The machine repeats the cycle until all substrates within the fixture are processed.

9.Finally, the finished products are returned to the magazine.

Machine Layout

Dimensions: 1440 × 1200 × 1850 mm

Weight: 1200 kg

Power Consumption: 2 kW

Air Pressure: 0.4 – 0.6 MPa

Voltage: 220 V

Positioning Accuracy: ±10 μm

Angular Accuracy: ±1°

Bonding Pressure: 10 – 50 g (can be increased up to 200 g by replacing tension springs)

Wafer Size: Dual 6" wafers (other wafer sizes customizable)

Substrate Worktable Travel: X: 140 mm, Y: 200 mm

Chip Size Range: 0.2 – 5 mm