RD-3000 Versatile Eutectic Die Bonder

RD-3000 is a versatileeutectic die bondersuitable for adhesiveand eutectic chip packaging processes. ● Automatic nozzle change mechanism. ● Air-floating bonding head mechanism to ensure placement accuracy and consistent bonding pressure. ● Compat

Fully Automatic Multi-Function Die Bonder DB-561

● Supports placement of multiple chip types simultaneously ● Equipped with an auto-zoom motorized lens to accommodate different component sizes ● Programmable operation for various process requirements

Fully Automatic Pulse-Heating Eutectic Bonder PH-550P

PH-550P is a eutectic bonding machineused in COB and COC processes. It bonds the substrate and chip by melting solder according to a controlled temperature profile after CCD-based positioning.The system is primarily composed of a eutectic bonding stage, c

TO Base Assembly Die Bonder 25G ET-503

ET-503 25G Base Assembly DieBonder is designed for the eutectic assembly of 25G TO56 and TO60 bases with large heat sinks. This automated production system bonds multiple solder preforms between the 25G large heat sink and the TO56 or TO60 base through co

Fully Automatic TO56 Eutectic Bonder ET-501P

The ET-501P is a dedicated production machinedesigned to eutectically bond the submount and chip(LD) onto a TO56 header through a controlled heating process.

Chip sorter ET-301WF

PH-100

Manual pulse heating eutectic machine

1, PH-100是COC等制程中將耐高溫基底與芯片，經過控制溫度曲線熔化焊料從而鍵合在一-起的共晶設備。 2,設備主要由共晶臺，貼片吸嘴組件，對位CCD，脈沖加熱系統等組成。 3,共晶臺包含X、Y、T三軸系統組成，上面設置共晶加熱模塊，冷氮氣環境保護系統，共晶臺冷卻系統。 4,貼片吸嘴組件設在Z軸上……