Shenzhen REB Automation Equipment Co., Ltd. is a high-tech enterprise specializing in the R&D, manufacturing, and sales of semiconductor packaging equipment. We operate a 6000?m2 standardized assembly facility, including an incoming material inspection lab, standard parts warehouse, precision adjustment workshop, equipment showroom, granite calibration platform, 2.5D measuring instruments, and micron-precision laser interferometers. We have an outstanding engineering R&D and after-sales team, consisting of 15 R&D engineers with bachelor’s degrees or higher, all graduates of top-tier domestic universities, and 3 engineering managers with over 10 years of industry experience. Under their leadership, all foundational R&D projects progress efficiently, ensuring that our products consistently meet market demands. We also hold a controlling stake in a precision machining enterprise, staffed with 30 skilled technicians and equipped with 8 CNC machining centers, 12 milling machines, 2 tapping machines, and multiple auxiliary devices, enabling us to fulfill orders on time and with assured quality.

Currently, we focus on flip-chip packaging and various packaging equipment for TO, COB, and COC applications, while providing comprehensive, turnkey solutions. With in-depth technical expertise, our independently developed and continuously optimized semiconductor production equipment has earned widespread recognition in real-world applications.

We remain committed to technological innovation, continuously refining and improving our products in response to industry trends and customer needs, aiming to become a leading enterprise in the semiconductor packaging equipment sector. We will continue to uphold our core values of integrity, independent innovation, ambitious creativity, and pragmatic efficiency, providing high-quality and prompt services to our partners and friends across the industry.