Automatic Dispensing Die Bonder DB-560P

High-Precision Eutectic Die Bonder

DB-560P is a production machinedesigned for COB/COC processes, bonding substrates (PCBs or other materials) to chips using an automated dispensing process. Manual Loading: Place the substrate tray into the feed cassette, then install the cassette on

Automatic Dispensing and Die Bonder DB-560EML

High-Precision Eutectic Die Bonder

This machineis an automated production system designed to bond TO sockets to chips through a dispensing process after rotating the TO sockets to a specified angle (?) during the manufacturing process. Manual Loading: Place the TO socket strips into

Fully Automatic Multifunctional Die Bonder RD-800

High-Precision Eutectic Die Bonder

RD-800 is a fully automatic multifunctional die bonder designed for high-precision multi-chip placement in packaging processes.

Automatic Die Attach Machine DB-560

High-Precision Eutectic Die Bonder

The substrate is manually placed into the substrate fixture, which is then loaded into the automatic loading/unloading magazine. Chip trays or blue tapes are also manually loaded.